GB/T 11093-1989
Replaced
T/SHDSGY 160-2022
Active
Group standards
T/SHDSGY 160-2022 Non-contact Silicon Wafer Transfer Device Technical Specification
T/SHDSGY 160-2022 Non-contact Silicon Wafer Transfer Device Technical Specification
Price:
$ 20.00
Basic Information
Standard Code:
T/SHDSGY 160-2022
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Semiconductor materials
Publish Date:
2022-11-30
Implement Date:
2022-11-30
Scope
Main technical content: This document specifies the terms and definitions, technical requirements, solutions, drawings, performance parameters, user manuals, inspection requirements, markings, packaging, transportation, and storage of non-contact silicon wafer transfer devices. This document is applicable to the technical specifications of non-contact silicon wafer transfer devices.
Development Information
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced