T/CIET 1005-2025 Active Group standards

T/CIET 1005-2025 Semiconductor packaging glass through-hole (TGV) baseplate technology specification

Publish Date: 2025-01-22 Implement Date: 2025-01-22 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CIET 1005-2025

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Semiconductor materials

Publish Date: 2025-01-22

Implement Date: 2025-01-22

Scope

Scope: This document defines the terms and definitions of glass through-hole (TGV) substrates for semiconductor packaging, and specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage for these substrates. This document applies to glass through-hole (TGV) substrates for semiconductor packaging. Main technical content: This document defines the terms and definitions of glass through-hole (TGV) substrates for semiconductor packaging, and specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage for these substrates. This document applies to glass through-hole (TGV) substrates for semiconductor packaging.