GB/T 44937.3-2025 Integrated circuits—Measurement of electromagnetic emissions—Part 3:Measurement of radiated emissions—Surface scan method

Scope

This document describes a method for measuring the near-field electric, magnetic, or electromagnetic components on or near the surface of integrated circuits (ICs). This measurement method is intended for use in IC architecture analysis, such as floor planning and power distribution optimization. It is also suitable for measuring ICs installed on any circuit board that can be accessed by a scanning probe. In some cases, this measurement method can scan not only the IC but also its surrounding environment. To compare the surface scan emissions of different ICs, it is recommended to use the standard test boards specified in IEC 61967-1. This measurement method provides a near-field emission map of the electric or magnetic fields above the IC. The resolution of the measurement depends on the performance of the measurement probe and the accuracy of the probe positioning system. The maximum expected frequency for this method is 6 GHz. The upper frequency limit can be extended using existing probe technology, but this is beyond the scope of this document. The measurement can be performed in either the frequency domain or the time domain.

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