GB/T 44937.2-2025 Active National standards

GB/T 44937.2-2025 Integrated circuits—Measurement of electromagnetic emissions—Part 2:Measurement of radiated emissions—TEM cell and wideband TEM cell method

GB/T 44937.2-2025 Integrated circuits—Measurement of electromagnetic emissions—Part 2:Measurement of radiated emissions—TEM cell and wideband TEM cell method

Publish Date: 2025-12-31 Implement Date: 2026-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: GB/T 44937.2-2025
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor integrated circuits
ICS Name: Integrated circuits, microelectronics
Publish Date: 2025-12-31
Implement Date: 2026-07-01
Pages: 20 pages

Scope

This document describes a method for measuring the electromagnetic radiation of integrated circuits (ICs). The IC under test needs to be installed on an IC test printed circuit board (PCB), which is fixed to the top or bottom of a TEM (Transverse Electromagnetic) chamber or GTEM (Gigahertz Transverse Electromagnetic) chamber cut out of a matching port (called a shell port). Unlike the usual practice of placing the PCB inside the chamber, this PCB is used as part of the chamber wall. This method is applicable to any TEM or GTEM chamber that has been modified to add a shell port (see Appendix B). However, the measured RF voltage will be influenced by many factors. The main factor affecting the measured RF voltage is the distance between the core board and the IC test PCB (chamber shell).
This method uses a 1 GHz TEM chamber (with a distance of 45 mm between the core board and the ground plane) and a GTEM chamber (with an average distance of 45 mm between the core board and the matching port area ground plane). Other chambers may not produce the same spectral output, but they can also be used for comparative measurements as long as the frequency and sensitivity characteristics allow. For measurement data from TEM or GTEM chambers with different distances between the ground plane and the core board, the data will be compared after applying correction coefficients.
The IC test PCB controls the geometric position and orientation of the working IC relative to the chamber, avoiding any cable connections within the chamber (these cables are arranged on the back of the PCB, outside the chamber). One 50 Ohm port of the TEM chamber is terminated with a 50 Ohm load. Another 50 Ohm port of the TEM chamber or the sole 50 Ohm port of the GTEM chamber is connected to the input of a spectrum analyzer or receiver to measure the RF emission generated by the IC and transmitted on the chamber core board.

Development Information

Word Count: 31 Thousand words Pages: 20 pages

Same series standard

Referenced Standards

IEC 60050-131 IEC 60050-161 IEC 61967-1

Adopt standards

IEC 61967-2:2005

Related Standards

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