GB/T 11093-1989
Replaced
T/IAWBS 020-2024
Active
Group standards
T/IAWBS 020-2024 Carbon-dioxide outer-growth layer deep energy level defect testing: Transient capacitance method
T/IAWBS 020-2024 Carbon-dioxide outer-growth layer deep energy level defect testing: Transient capacitance method
Price:
$ 20.00
Basic Information
Standard Code:
T/IAWBS 020-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semi-metals and semiconductor materials
ICS Name:
Semiconductor materials
Publish Date:
2024-02-27
Implement Date:
2024-03-05
Scope
Main technical content: This document specifies a method for measuring deep-level defects in silicon carbide (SiC) epitaxial materials using the deep-level transient spectroscopy method in transient capacitance technology. This document is suitable for measuring impurities and defects in the epitaxial layer of silicon carbide materials that produce deep levels in the semiconductor band gap. This method can obtain parameters such as the activation energy of deep levels, concentration, and capture cross section of deep levels
Development Information
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced