JB/T 6481-1992
Active
GB/T 8446.2-2022
Active
National standards
GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2:Measurement methods of thermal resistance andinlet-outlet fluid pressure drop
GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2:Measurement methods of thermal resistance andinlet-outlet fluid pressure drop
Price:
$ 66
Basic Information
Standard Code:
GB/T 8446.2-2022
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Power semiconductor devices and components
ICS Name:
Integrated Electromechanical Components
Publish Date:
2022-03-09
Implement Date:
2022-10-01
Pages:
16 pages
Scope
This document provides the terminology and definitions of thermal resistance and flow resistance for heat sinks used in power semiconductor devices, as well as measurement methods.
This document is applicable to the measurement of thermal resistance and flow resistance for heat sinks used in power semiconductor devices, including cast, extruded, profile, and heat pipe heat sinks.
Development Information
Same series standard
Replace the following standards
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