GB/T 41215-2021
Active
GB/Z 41275.4-2023
Active
National standards
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array(BGA) re-balling
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array(BGA) re-balling
Price:
$ 122
Basic Information
Standard Code:
GB/Z 41275.4-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic components
ICS Name:
Comprehensive materials for aerospace manufacturing
Publish Date:
2023-12-28
Implement Date:
2024-07-01
Pages:
38 pages
Scope
This document specifies the requirements for replacing solder balls on ball grid array (BGA) components in the context of the electronic component management plan (ECMP) for aerospace, defense, and high-reliability products.
Development Information
Same series standard
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22:Technical guidelines
GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
Referenced Standards
IEC 61340-5-1
IEC/TR 61340-5-2
IEC 62090
IEC 62668(所有部分)
AEC-Q100-010
ANSI/ESD S20.20
ECA/IPC/JEDEC J-STD-075
IPC J-STD-001
IPC J-STD-001xS
IPC J-STD-004
IPC J-STD-005
IPC/JEDEC J-STD-020
IPC/JEDEC J-STD-033
JEDEC J-STD-046
JEDEC JESD625
JEDEC JESD22-B107
SAE AS5553
Adopt standards
IEC TS 62647-4:2018
Related Standards
GB/T 41275.21-2022
Active
GB/T 41275.21-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21:Guidelines for transition to lead-free electronics
GB/T 41275.2-2022
Active
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin
GB/T 41275.3-2022
Active
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes
GB/T 41886-2022
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GB/T 41886-2022 Requirements for cabin acoustic design of transport aircraft
GB/T 42846-2023
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