GB/T 29845-2013 Guide for final assembly,packaging,transportation, unpacking,and relocation of semiconductor manufacturing equipment
GB/T 29845-2013 Guide for final assembly,packaging,transportation, unpacking,and relocation of semiconductor manufacturing equipment
Basic Information
Scope
This standard provides guidelines for specific activities such as the final assembly (general assembly), packaging, and transportation of semiconductor manufacturing equipment (SME) in the supplier's factory, as well as the unpacking and installation in the customer's cleanroom production area.
This standard applies to the final assembly (general assembly), packaging, and transportation of semiconductor manufacturing equipment, independent components, and parts in the supplier's factory, as well as the transfer process from the customer's loading dock/reception area to the cleanroom production area for high-purity and ultra-high purity applications.
This standard does not include special requirements related to the environment, health, and safety (EHS), nor does it apply to processing process specifications related to wafer particles or wafer quality (such as ionic contamination levels).