GB/T 29845-2013 Active National standards

GB/T 29845-2013 Guide for final assembly,packaging,transportation, unpacking,and relocation of semiconductor manufacturing equipment

GB/T 29845-2013 Guide for final assembly,packaging,transportation, unpacking,and relocation of semiconductor manufacturing equipment

Publish Date: 2013-11-12 Implement Date: 2014-04-15 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 29845-2013
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Electronic industry production equipment
ICS Name: Electronic product production equipment
Publish Date: 2013-11-12
Implement Date: 2014-04-15
Pages: 10 pages

Scope

This standard provides guidelines for specific activities such as the final assembly (general assembly), packaging, and transportation of semiconductor manufacturing equipment (SME) in the supplier's factory, as well as the unpacking and installation in the customer's cleanroom production area.
This standard applies to the final assembly (general assembly), packaging, and transportation of semiconductor manufacturing equipment, independent components, and parts in the supplier's factory, as well as the transfer process from the customer's loading dock/reception area to the cleanroom production area for high-purity and ultra-high purity applications.
This standard does not include special requirements related to the environment, health, and safety (EHS), nor does it apply to processing process specifications related to wafer particles or wafer quality (such as ionic contamination levels).

Development Information

Word Count: 16 Thousand words Pages: 10 pages

Referenced Standards

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