GB/T 4855-1984
Abolished
GB/T 42835-2023
Active
National standards
GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)
GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)
Basic Information
Standard Code:
GB/T 42835-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semiconductor integrated circuits
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2023-08-06
Implement Date:
2023-12-01
Pages:
13 pages
Scope
This document specifies the technical requirements, electrical testing methods, and inspection rules for system-on-chips (SoCs).
This document is applicable to the design, manufacturing, procurement, and acceptance of system-on-chips (SoCs).
Development Information
Referenced Standards
GB/T 17574-1998 Semiconductor devices Integrated circuits Part 2:Digital integrated circuits
GB/T 17626.2-2018 Electromagnetic compatibility—Testing and measurement techniques—Electrostatic discharge immunity test
GB/T 17626.4-2018 Electromagnetic compatibility—Testing and measurement techniques—Electrical fast transient/burstimmunity test
IEC 60749-6
IEC 60749-8
IEC 60749-9
IEC 60749-24
IEC 60749-28
IEC 60749-36
IEC 61967-2
IEC TS 61967-3
IEC 61967-4
IEC 62132-2
IEC 62132-4
IEC 62215-3
GB/T 191-2000 Packaging—Pictorial marking for handling of goods
GB/T 191-2008 Packaging—Pictorial marking for handling of goods
GB/T 4937.3-2012 Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination
GB/T 4937.4-2012 Semiconductor devices—Mechanical and climatic test methods—Part 4:Damp heat,steady state,highly accelerated stress test(HAST)
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity)
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climate test methods—Part 26:Electrostatic discharge(ESD)sensitivity testing—Human body model(HBM)
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27:Electrostatic discharge (ESD) sensitivity testing—Machine model (MM)
GB/T 9178-1988 Terminology for integrated circuits
GB/T 12750-1991 Sectional specification for semiconductor integrated circuits, excluding hybrid circuits
GB/T 12750-2006 Semiconductor devices—Integrated circuits—Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
GB/T 191-2025 Graphical symbols marking for handling and storage of packages
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished