GB/T 42835-2023 Active National standards

GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)

GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)

Publish Date: 2023-08-06 Implement Date: 2023-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 42835-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor integrated circuits
ICS Name: Integrated circuits, microelectronics
Publish Date: 2023-08-06
Implement Date: 2023-12-01
Pages: 13 pages

Scope

This document specifies the technical requirements, electrical testing methods, and inspection rules for system-on-chips (SoCs).
This document is applicable to the design, manufacturing, procurement, and acceptance of system-on-chips (SoCs).

Development Information

Word Count: 27 Thousand words Pages: 13 pages

Referenced Standards

GB/T 17574-1998 Semiconductor devices Integrated circuits Part 2:Digital integrated circuits GB/T 17626.2-2018 Electromagnetic compatibility—Testing and measurement techniques—Electrostatic discharge immunity test GB/T 17626.4-2018 Electromagnetic compatibility—Testing and measurement techniques—Electrical fast transient/burstimmunity test IEC 60749-6 IEC 60749-8 IEC 60749-9 IEC 60749-24 IEC 60749-28 IEC 60749-36 IEC 61967-2 IEC TS 61967-3 IEC 61967-4 IEC 62132-2 IEC 62132-4 IEC 62215-3 GB/T 191-2000 Packaging—Pictorial marking for handling of goods GB/T 191-2008 Packaging—Pictorial marking for handling of goods GB/T 4937.3-2012 Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination GB/T 4937.4-2012 Semiconductor devices—Mechanical and climatic test methods—Part 4:Damp heat,steady state,highly accelerated stress test(HAST) GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity) GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life GB/T 4937.26-2023 Semiconductor devices—Mechanical and climate test methods—Part 26:Electrostatic discharge(ESD)sensitivity testing—Human body model(HBM) GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27:Electrostatic discharge (ESD) sensitivity testing—Machine model (MM) GB/T 9178-1988 Terminology for integrated circuits GB/T 12750-1991 Sectional specification for semiconductor integrated circuits, excluding hybrid circuits GB/T 12750-2006 Semiconductor devices—Integrated circuits—Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits GB/T 191-2025 Graphical symbols marking for handling and storage of packages

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