GB/T 14264-1993
Replaced
GB/T 4937.38-2025
Pending
National standards
GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38:Soft error test method for semiconductor devices with memory
GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38:Soft error test method for semiconductor devices with memory
Basic Information
Standard Code:
GB/T 4937.38-2025
Standard Type:
National standards
Standard Status:
Pending
is_force_gb:
no
CCS Name:
Semiconductor discrete devices
ICS Name:
Integrated Components of Semiconductor Devices
Publish Date:
2025-12-02
Implement Date:
2026-07-01
Publisher:
国家市场监督管理总局、国家标准化管理委员会
Technical Committee:
全国半导体器件标准化技术委员会(SAC/TC 78)
Pages:
16 pages
Scope
本文件描述了带存储的半导体器件工作在高能粒子环境下(如阿尔法辐射)的软错误敏感性的试验方法。本文件包含了两种试验方法，分别为利用阿尔法粒子辐射源的加速试验和自然辐射环境下(如阿尔法粒子或中子)导致错误的(非加速)实时系统试验。
为了全面表征带存储半导体器件的软错误特性，还需要依照其他试验方法开展宽能谱高能中子和热中子试验。
本试验方法适用于所有带存储的半导体器件。
Development Information
Drafting Units:
工业和信息化部电子第五研究所、北京智芯微电子科技有限公司、安徽一天电气技术股份有限公司、安徽钜芯半导体科技股份有限公司
Drafting Persons:
雷志锋、彭超、黄云、何玉娟、张战刚、何凡、付青琴、恩云飞、来萍、余银钢、曹孙根
Same series standard
GB/T 4937.8-2025 Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing
GB/T 4937.10-2025 Semiconductor devices—Mechanical and climatic tests methods—Part 10:Mechanical Shock—Device and subassembly
GB/T 4937.16-2025 Semiconductor devices—Mechanical and climatic test methods—Part 16:Particle impact noise detection(PIND)
GB/T 4937.24-2025 Semiconductor devices—Mechanical and climatic test methods—Part 24:Accelerated moisture resistance—Unbiased HAST
GB/T 4937.25-2025 Semiconductor devices—Mechanical and climatic test methods—Part 25:Temperature cycling
GB/T 4937.29-2025 Semiconductor devices—Mechanical and climatic test methods—Part 29:Latch-up test
GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33:Accelerated moisture resistance—Unbiased autoclave
GB/T 4937.36-2025 Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration,steady state
GB/T 4937.37-2025 Semiconductor devices—Mechanical and climatic test methods—Part 37:Board level drop test method using an accelerometer
GB/T 4937.39-2025 Semiconductor devices—Mechanical and climatic test methods—Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
GB/T 4937.40-2025 Semiconductor devices—Mechanical and climatic test methods—Part 40:Board level drop test method using a strain gauge
GB/T 4937.44-2025 Semiconductor devices—Mechanical and climatic test methods—Part 44:Neutron beam irradiated single event effect(SEE) test method for semiconductor devices
Adopt standards
IEC 60749-38:2008
Related Standards
GB/T 14844-1993
Replaced
GB/T 14844-1993 Designations of semiconductor materials
GB/T 17573-1998
Active
GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1:General
GB/T 12560-1999
Active
GB/T 12560-1999 Semiconductor devices Sectional specification for discrete devices
GB/T 11499-2001
Active
GB/T 11499-2001 Letter symbols for discrete semiconductor devices
GB/T 20521-2006
Active