GB/T 4937.37-2025 Semiconductor devices—Mechanical and climatic test methods—Part 37:Board level drop test method using an accelerometer

Scope

This document describes a test method for evaluating and comparing the drop performance of surface-mounted devices in handheld electronic products in an accelerated test environment. Excessive bending of the circuit board during the drop test can cause failure of the electronic products. The purpose of this document is to standardize the test circuit boards and test methods, provide reproducible evaluation of the drop test for surface-mounted devices, and enable the same failure modes to be obtained in product-level testing. This document specifies a standard test method and reporting requirements. This document is different from device qualification tests, system-level drop tests for determining the quality of handheld electronic products, and vibration tests simulating the vibrations generated during the transportation and handling of devices or printed circuit board assemblies, for which the method requirements are specified in GB/T 4937.10-2025, for example. This method is applicable to face-array packages and four-edge lead surface-mounted packages. This test method uses accelerometers to measure the duration and amplitude of mechanical shocks, with the amplitude being proportional to the force on a given device mounted on a standard board. IEC 60749-40 describes a test method for measuring the strain and strain rate of the peripheral circuit board of a device using strain gauges. The detailed specifications explain the test methods used.

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