GB/T 4937.40-2025 Semiconductor devices—Mechanical and climatic test methods—Part 40:Board level drop test method using a strain gauge

Scope

This document describes a test method for evaluating and comparing the drop performance of surface-mounted semiconductor devices in handheld electronic product applications in accelerated test environments, where excessive bending of the circuit board can lead to product failure. The aim is to standardize the test method to provide reproducible evaluation of the drop test performance of surface-mounted semiconductor devices, while replicating the failure modes commonly observed during product-level testing.
This document is applicable to using strain gauges to measure the strain and strain rate of the circuit board near the device. IEC 60749-37 is applicable to using accelerometers to measure the duration and intensity of the applied mechanical shock, which is proportional to the stress experienced by a given device mounted on a standard board. The detailed specifications specify which test method to use.
Note 1: Although this test can evaluate the structure composed of the installation method and its conditions, the PCB design, soldering materials, and the installation capability of the semiconductor device, it cannot evaluate the installation capability of the semiconductor device alone.
Note 2: The results of this test are greatly influenced by different soldering conditions, PCB pad pattern design, and soldering materials. Therefore, this test cannot fundamentally guarantee the reliability of the solder joints of the semiconductor device.
Note 3: This test is not applicable when the mechanical stress generated by this test does not occur in the actual use of the device.

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