GB/T 4937.8-2025 Pending National standards

GB/T 4937.8-2025 Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing

GB/T 4937.8-2025 Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing

Publish Date: 2025-12-31 Implement Date: 2026-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 4937.8-2025
Standard Type: National standards
Standard Status: Pending
is_force_gb: no
CCS Name: Semiconductor discrete devices
ICS Name: Integrated Components of Semiconductor Devices
Publish Date: 2025-12-31
Implement Date: 2026-07-01
Publisher: 国家市场监督管理总局、国家标准化管理委员会
Technical Committee: 全国半导体器件标准化技术委员会(SAC/TC 78)
Pages: 16 pages

Scope

本文件适用于半导体器件(分立器件和集成电路)。
本试验方法的目的是检测半导体器件的漏率。

Development Information

Drafting Units:

中国电子技术标准化研究院、江苏韩电电器有限公司、苏州海光芯创光电科技股份有限公司、阿母芯微电子技术(中山)有限公司、青岛金汇源电子有限公司

Drafting Persons:

罗晓羽、孙明、甘鑫涛、胡朝阳、薛冬英、程文娟

Word Count: 25 Thousand words Pages: 16 pages

Same series standard

GB/T 4937.10-2025 Semiconductor devices—Mechanical and climatic tests methods—Part 10:Mechanical Shock—Device and subassembly GB/T 4937.16-2025 Semiconductor devices—Mechanical and climatic test methods—Part 16:Particle impact noise detection(PIND) GB/T 4937.24-2025 Semiconductor devices—Mechanical and climatic test methods—Part 24:Accelerated moisture resistance—Unbiased HAST GB/T 4937.25-2025 Semiconductor devices—Mechanical and climatic test methods—Part 25:Temperature cycling GB/T 4937.29-2025 Semiconductor devices—Mechanical and climatic test methods—Part 29:Latch-up test GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33:Accelerated moisture resistance—Unbiased autoclave GB/T 4937.36-2025 Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration,steady state GB/T 4937.37-2025 Semiconductor devices—Mechanical and climatic test methods—Part 37:Board level drop test method using an accelerometer GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38:Soft error test method for semiconductor devices with memory GB/T 4937.39-2025 Semiconductor devices—Mechanical and climatic test methods—Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components GB/T 4937.40-2025 Semiconductor devices—Mechanical and climatic test methods—Part 40:Board level drop test method using a strain gauge GB/T 4937.44-2025 Semiconductor devices—Mechanical and climatic test methods—Part 44:Neutron beam irradiated single event effect(SEE) test method for semiconductor devices

Referenced Standards

Adopt standards

IEC 60749-8:2002

Related Standards

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