GB/T 4937.33-2025 Active National standards

GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33:Accelerated moisture resistance—Unbiased autoclave

GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33:Accelerated moisture resistance—Unbiased autoclave

Publish Date: 2025-12-02 Implement Date: 2026-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: GB/T 4937.33-2025

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Semiconductor discrete devices

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2025-12-02

Implement Date: 2026-07-01

Pages: 12 pages

Scope

The unbiased high-pressure steam cooking test uses condensed moisture or saturated steam to evaluate the moisture resistance of non-airtight encapsulated solid devices. This test is a highly accelerated test that accelerates the penetration of moisture through the external protective material (encapsulation or sealing) or the interface between the external protective material and metal conductors under condensation conditions.
This document is suitable for confirming the failure mechanism inside the encapsulation and is used for destructive testing.

Development Information

Word Count: 17 Thousand words Pages: 12 pages

Same series standard

GB/T 4937.8-2025 Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing GB/T 4937.10-2025 Semiconductor devices—Mechanical and climatic tests methods—Part 10:Mechanical Shock—Device and subassembly GB/T 4937.16-2025 Semiconductor devices—Mechanical and climatic test methods—Part 16:Particle impact noise detection(PIND) GB/T 4937.24-2025 Semiconductor devices—Mechanical and climatic test methods—Part 24:Accelerated moisture resistance—Unbiased HAST GB/T 4937.25-2025 Semiconductor devices—Mechanical and climatic test methods—Part 25:Temperature cycling GB/T 4937.29-2025 Semiconductor devices—Mechanical and climatic test methods—Part 29:Latch-up test GB/T 4937.36-2025 Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration,steady state GB/T 4937.37-2025 Semiconductor devices—Mechanical and climatic test methods—Part 37:Board level drop test method using an accelerometer GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38:Soft error test method for semiconductor devices with memory GB/T 4937.39-2025 Semiconductor devices—Mechanical and climatic test methods—Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components GB/T 4937.40-2025 Semiconductor devices—Mechanical and climatic test methods—Part 40:Board level drop test method using a strain gauge GB/T 4937.44-2025 Semiconductor devices—Mechanical and climatic test methods—Part 44:Neutron beam irradiated single event effect(SEE) test method for semiconductor devices

Referenced Standards

IEC 60749-24

Adopt standards

IEC 60749-33:2004

Related Standards

GB/T 14264-1993 Replaced

GB/T 14264-1993 Semiconductor materials—Terms and definitions

Publish Date: 1993-03-12

GB/T 14844-1993 Replaced

GB/T 14844-1993 Designations of semiconductor materials

Publish Date: 1993-12-24

GB/T 17573-1998 Active

GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1:General

Publish Date: 1998-11-17

GB/T 12560-1999 Active

GB/T 12560-1999 Semiconductor devices Sectional specification for discrete devices

Publish Date: 1999-08-02

GB/T 11499-2001 Active

GB/T 11499-2001 Letter symbols for discrete semiconductor devices

Publish Date: 2001-11-05

GB/T 20521-2006 Active

GB/T 20521-2006 Semiconductor devices—Part 14-1:Semiconductor sensors—General and classification

Publish Date: 2006-08-23