GB/T 4937.25-2025 Semiconductor devices—Mechanical and climatic test methods—Part 25:Temperature cycling

Scope

This document describes the ability of semiconductor devices, components, and circuit board assemblies to withstand mechanical stress caused by alternating extreme high and low temperatures. This mechanical stress can lead to permanent changes in their electrical or physical performance. This document generally complies with IEC 60068-2-14, but due to the special requirements of semiconductor devices, the provisions of this document are used. This test method can use the single-chamber method, the two-chamber method, and the three-chamber method for temperature cycling tests of individual components and solder joint interconnections. When conducting temperature cycling tests with the single-chamber method, the load is placed in a fixed test chamber, and hot air, ambient air, or cold air is introduced into the test chamber to heat or cool the load. When conducting temperature cycling tests with the two-chamber method, the load is placed on a movable platform, which moves between two fixed test chambers that maintain set temperatures. When conducting temperature cycling tests with the three-chamber method, the load moves between three test chambers.

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