GB/T 14264-1993
Replaced
GB/T 4937.39-2025
Pending
National standards
GB/T 4937.39-2025 Semiconductor devices—Mechanical and climatic test methods—Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
GB/T 4937.39-2025 Semiconductor devices—Mechanical and climatic test methods—Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Basic Information
Standard Code:
GB/T 4937.39-2025
Standard Type:
National standards
Standard Status:
Pending
is_force_gb:
no
CCS Name:
Semiconductor discrete devices
ICS Name:
Integrated Components of Semiconductor Devices
Publish Date:
2025-12-31
Implement Date:
2026-07-01
Publisher:
国家市场监督管理总局、国家标准化管理委员会
Technical Committee:
全国半导体器件标准化技术委员会(SAC/TC 78)
Pages:
20 pages
Scope
本文件描述了应用于半导体器件封装用有机材料的潮气扩散率和水溶解度的测量方法。
潮气扩散率和水溶解度两个参数是有效表征塑封半导体器件暴露于潮湿环境和经受高温回流焊之后可靠性的重要参数。
Development Information
Drafting Units:
工业和信息化部电子第五研究所、吉林华微电子股份有限公司、合肥美菱物联科技有限公司、深圳芯茂微电子股份有限公司、电子科技大学、深圳市金誉半导体股份有限公司、西安卫光科技有限公司、中国电子科技集团公司第十三研究所、阿母芯微电子技术(中山)有限公司
Drafting Persons:
陈媛、何小琦、路国光、来萍、黄云、李强、常江、石高明、梁晓思、武慧薇、陈选龙、陈义强、贺致远、赵鑫、王嘉蓉、彭浩、孔玲娜、姜明宝、魏邦福、薛冬英、邹荣涛
Same series standard
GB/T 4937.8-2025 Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing
GB/T 4937.10-2025 Semiconductor devices—Mechanical and climatic tests methods—Part 10:Mechanical Shock—Device and subassembly
GB/T 4937.16-2025 Semiconductor devices—Mechanical and climatic test methods—Part 16:Particle impact noise detection(PIND)
GB/T 4937.24-2025 Semiconductor devices—Mechanical and climatic test methods—Part 24:Accelerated moisture resistance—Unbiased HAST
GB/T 4937.25-2025 Semiconductor devices—Mechanical and climatic test methods—Part 25:Temperature cycling
GB/T 4937.29-2025 Semiconductor devices—Mechanical and climatic test methods—Part 29:Latch-up test
GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33:Accelerated moisture resistance—Unbiased autoclave
GB/T 4937.36-2025 Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration,steady state
GB/T 4937.37-2025 Semiconductor devices—Mechanical and climatic test methods—Part 37:Board level drop test method using an accelerometer
GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38:Soft error test method for semiconductor devices with memory
GB/T 4937.40-2025 Semiconductor devices—Mechanical and climatic test methods—Part 40:Board level drop test method using a strain gauge
GB/T 4937.44-2025 Semiconductor devices—Mechanical and climatic test methods—Part 44:Neutron beam irradiated single event effect(SEE) test method for semiconductor devices
Referenced Standards
IEC 60749-20
Adopt standards
IEC 60749-39:2021
Related Standards
GB/T 14844-1993
Replaced
GB/T 14844-1993 Designations of semiconductor materials
GB/T 17573-1998
Active
GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1:General
GB/T 12560-1999
Active
GB/T 12560-1999 Semiconductor devices Sectional specification for discrete devices
GB/T 11499-2001
Active
GB/T 11499-2001 Letter symbols for discrete semiconductor devices
GB/T 20521-2006
Active