GB/T 42837-2023 Active National standards

GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier

GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier

Publish Date: 2023-08-06 Implement Date: 2023-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 42837-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor integrated circuits
ICS Name: Integrated circuits, microelectronics
Publish Date: 2023-08-06
Implement Date: 2023-12-01
Pages: 13 pages

Scope

This document specifies the classification, technical requirements, testing methods, and inspection rules for amplifiers.
This document is applicable to the design, manufacture, procurement, and acceptance of amplifiers that are designed and manufactured using semiconductor integrated circuit technology.

Development Information

Word Count: 27 Thousand words Pages: 13 pages

Referenced Standards

GB/T 20870.1-2007 Semiconductor devices—Part 16-1:Microwave integrated circuits—Amplifiers IEC 60749-6 IEC 60749-8 IEC 60749-9 IEC 60749-24 IEC 60749-28 IEC 60749-36 GB/T 4589.1-2006 Semiconductor devices—Part 10:Generic specification for discrete devices and integrated circuits GB/T 4937.3-2012 Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination GB/T 4937.4-2012 Semiconductor devices—Mechanical and climatic test methods—Part 4:Damp heat,steady state,highly accelerated stress test(HAST) GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity) GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life GB/T 4937.26-2023 Semiconductor devices—Mechanical and climate test methods—Part 26:Electrostatic discharge(ESD)sensitivity testing—Human body model(HBM) GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27:Electrostatic discharge (ESD) sensitivity testing—Machine model (MM) GB/T 9178-1988 Terminology for integrated circuits GB/T 12750-1991 Sectional specification for semiconductor integrated circuits, excluding hybrid circuits GB/T 12750-2006 Semiconductor devices—Integrated circuits—Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part11:Section1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) SJ/T 11587-2016 Electrostatic protection packaging requirements for electronic products SJ/T 10147-1991 Package tubes against static for integrated circuits

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