GB/T 4855-1984
Abolished
GB/T 42837-2023
Active
National standards
GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier
GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier
Basic Information
Standard Code:
GB/T 42837-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semiconductor integrated circuits
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2023-08-06
Implement Date:
2023-12-01
Pages:
13 pages
Scope
This document specifies the classification, technical requirements, testing methods, and inspection rules for amplifiers.
This document is applicable to the design, manufacture, procurement, and acceptance of amplifiers that are designed and manufactured using semiconductor integrated circuit technology.
Development Information
Referenced Standards
GB/T 20870.1-2007 Semiconductor devices—Part 16-1:Microwave integrated circuits—Amplifiers
IEC 60749-6
IEC 60749-8
IEC 60749-9
IEC 60749-24
IEC 60749-28
IEC 60749-36
GB/T 4589.1-2006 Semiconductor devices—Part 10:Generic specification for discrete devices and integrated circuits
GB/T 4937.3-2012 Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination
GB/T 4937.4-2012 Semiconductor devices—Mechanical and climatic test methods—Part 4:Damp heat,steady state,highly accelerated stress test(HAST)
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity)
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climate test methods—Part 26:Electrostatic discharge(ESD)sensitivity testing—Human body model(HBM)
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27:Electrostatic discharge (ESD) sensitivity testing—Machine model (MM)
GB/T 9178-1988 Terminology for integrated circuits
GB/T 12750-1991 Sectional specification for semiconductor integrated circuits, excluding hybrid circuits
GB/T 12750-2006 Semiconductor devices—Integrated circuits—Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part11:Section1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
SJ/T 11587-2016 Electrostatic protection packaging requirements for electronic products
SJ/T 10147-1991 Package tubes against static for integrated circuits
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished