GB/T 4855-1984
Abolished
GB/T 42974-2023
Active
National standards
GB/T 42974-2023 Semiconductor integrated circuits—Flash memory(FLASH)
GB/T 42974-2023 Semiconductor integrated circuits—Flash memory(FLASH)
Basic Information
Standard Code:
GB/T 42974-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semiconductor integrated circuits
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2023-09-07
Implement Date:
2024-01-01
Pages:
16 pages
Scope
This document specifies the classification, technical requirements, electrical testing methods, and inspection rules for flash memory (FLASH).
This document is applicable to the design, manufacturing, procurement, and acceptance of FLASH devices.
Development Information
Referenced Standards
GB/T 17574-1998 Semiconductor devices Integrated circuits Part 2:Digital integrated circuits
GB/T 36477-2018 Semiconductor integrated circuit—Measuring methods for flash memory
IEC 60749-6
IEC 60749-8
IEC 60749-9
IEC 60749-24
IEC 60749-28
IEC 60749-36
GB/T 191-2000 Packaging—Pictorial marking for handling of goods
GB/T 191-2008 Packaging—Pictorial marking for handling of goods
GB/T 4937.3-2012 Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination
GB/T 4937.4-2012 Semiconductor devices—Mechanical and climatic test methods—Part 4:Damp heat,steady state,highly accelerated stress test(HAST)
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity)
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climate test methods—Part 26:Electrostatic discharge(ESD)sensitivity testing—Human body model(HBM)
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27:Electrostatic discharge (ESD) sensitivity testing—Machine model (MM)
GB/T 9178-1988 Terminology for integrated circuits
GB/T 12750-1991 Sectional specification for semiconductor integrated circuits, excluding hybrid circuits
GB/T 12750-2006 Semiconductor devices—Integrated circuits—Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
GB/T 35003-2018 Test methods for endurance and data retention of non-volatile memory
GB/T 191-2025 Graphical symbols marking for handling and storage of packages
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished