GB/T 32278-2025 Test method for thickness and fltaness of monocrystalline silicon carbide wafers

Scope

This document describes the test methods for the thickness and flatness of silicon carbide single wafers, including contact and non-contact testing methods.
This document is applicable to the thickness and flatness testing of silicon carbide single wafers with a thickness of 0.13 mm to 1 mm and a diameter of 50.8 mm, 76.2 mm, 100 mm, 150 mm, and 200 mm.
This document is also applicable to the thickness and flatness testing of silicon carbide epitaxial wafers.

Development Information

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Referenced Standards

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