GB/T 11093-1989
Replaced
GB/T 43885-2024
Active
National standards
GB/T 43885-2024 Silicon carbide epitaxial wafers
GB/T 43885-2024 Silicon carbide epitaxial wafers
Price:
$ 54
Basic Information
Standard Code:
GB/T 43885-2024
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Compound semiconductor materials
ICS Name:
Semiconductor materials
Publish Date:
2024-04-25
Implement Date:
2024-11-01
Pages:
11 pages
Scope
This document specifies the product classification, technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of silicon carbide epitaxial wafers. This document is applicable to epitaxial wafers grown on conductive silicon carbide substrates with homogeneous silicon carbide epitaxial layers, which are used to fabricate silicon carbide power electronic devices.
Development Information
Referenced Standards
GB/T 2828.1-2012 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection
GB/T 6624-1995 Standard method for measuring the surface quality of polished silicon slices by visual inspection
GB/T 6624-2009 Standard method for measuring the surface quality of polished silicon slices by visual inspection
GB/T 14146-1993 Silicon epitaxial layers—Determination of carrier concentration—Mercury probe Valtage-capacitance method
GB/T 14146-2009 Silicon epitaxial layers-determination of carrier concentration-mercury probe voltages-capacitance method
GB/T 14146-2021 Test method for carrier concentration of silicon epitaxial layers—Capacitance-voltage method
GB/T 14264-1993 Semiconductor materials—Terms and definitions
GB/T 14264-2009 Semiconductor materials—Terms and definitions
GB/T 14264-2024 Terminology of semiconductor materials
GB/T 19921-2005 Test method of particles on silicon wafer surfaces
GB/T 19921-2018 Test method for particles on polished silicon wafer surfaces
GB/T 29505-2013 Test method for measuring surface roughness on planar surfaces of silicon wafer
GB/T 30656-2014 Polished monocrystalline silicon carbide wafers
GB/T 30656-2023 Polished monocrystalline silicon carbide wafers
GB/T 32278-2015 Test method for flatness of monocrystalline silicon carbide wafers
GB/T 39145-2020 Test method for the content of surface metal elements on silicon wafers—Inductively coupled plasma mass spectrometry
GB/T 42902-2023 Test method for surface defects on silicon carbide epitaxial wafers—Laser scattering method
GB/T 42905-2023 Test method for thickness of silicon carbide epitaxial layer—Infrared reflectance method
YS/T 28-1992 Silicon wafer packaging
YS/T 28-2015 Package of silicon wafers
YS/T 28-2024 YS/T 28-2024 Silicon wafer packaging and labeling
GB/T 32278-2025 Test method for thickness and fltaness of monocrystalline silicon carbide wafers
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced