GB/T 19921-2018 Active National standards

GB/T 19921-2018 Test method for particles on polished silicon wafer surfaces

GB/T 19921-2018 Test method for particles on polished silicon wafer surfaces

Publish Date: 2018-12-28 Implement Date: 2019-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 19921-2018

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: \nTest methods for the physical properties of metals

ICS Name: \nMetal material testing

Publish Date: 2018-12-28

Implement Date: 2019-07-01

Publisher: 国家市场监督管理总局、中国国家标准化管理委员会

Technical Committee: 全国半导体设备和材料标准化技术委员会(SAC/TC 203)、全国半导体设备和材料标准化技术委员会材料分技术委员会(SAC/TC 203/SC 2)

Pages: 29 pages

Scope

本标准规定了应用扫描表面检查系统对抛光片、外延片等镜面晶片表面的局部光散射体进行测试，对局部光散射体与延伸光散射体、散射光与反射光进行区分、识别和测试的方法。针对130 nm～11 nm线宽工艺用硅片，本标准提供了扫描表面检查系统的设置。
本标准适用于使用扫描表面检查系统对硅抛光片和外延片的表面局部光散射体进行检测、计数及分类，也适用于对硅抛光片和外延片表面的划伤、晶体原生凹坑进行检测、计数及分类，对硅抛光片和外延片表面的桔皮、波纹、雾以及外延片的棱锥、乳突等缺陷进行观测和识别。本标准同样适用于锗抛光片、化合物抛光片等镜面晶片表面局部光散射体的测试。
注：本标准中将硅、锗、砷化镓材料的抛光片和外延片及其他材料的镜面抛光片、外延片等统称为晶片。

Development Information

Drafting Units:

有研半导体材料有限公司、上海合晶硅材料有限公司、浙江金瑞泓科技股份有限公司、南京国盛电子有限公司、有色金属技术经济研究院、天津市环欧半导体材料技术有限公司

Drafting Persons:

孙燕、刘卓、冯泉林、徐新华、张海英、骆红、刘义、杨素心、张雪囡

Word Count: 50 Thousand words Pages: 29 pages

Replace the following standards

GB/T 19921-2005 Test method of particles on silicon wafer surfaces

Referenced Standards

SEMI M35 SEMI M52 SEMI M53 SEMI M58 GB/T 6624-1995 Standard method for measuring the surface quality of polished silicon slices by visual inspection GB/T 6624-2009 Standard method for measuring the surface quality of polished silicon slices by visual inspection GB/T 12964-2003 Monocrystalline silicon polished wafers GB/T 12964-2018 Monocrystalline silicon polished wafers GB/T 12965-1996 Monocrystalline silicon as cut slices and lapped slices GB/T 12965-2005 Monocrystalline silicon as cut slices and lapped slices GB/T 12965-2018 Monocrystalline silicon as cut wafers and lapped wafers GB/T 14139-1993 Silicon epitaxial wafers GB/T 14139-2009 Silicon epitaxial wafers GB/T 14139-2019 Silicon epitaxial wafers GB/T 14264-1993 Semiconductor materials—Terms and definitions GB/T 14264-2009 Semiconductor materials—Terms and definitions GB/T 14264-2024 Terminology of semiconductor materials GB/T 25915.1-2010 Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness GB/T 25915.1-2021 Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness by particle concentration GB/T 29506-2013 300 mm polished monocrystalline silicon wafers

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