GB/T 26068-2010 Replaced National standards

GB/T 26068-2010 Test method for carrier recombination lifetime in silicon wafers by non-contact measurement of photoconductivity decay by microwave reflectance

GB/T 26068-2010 Test method for carrier recombination lifetime in silicon wafers by non-contact measurement of photoconductivity decay by microwave reflectance

Publish Date: 2011-01-10 Implement Date: 2011-10-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 26068-2010
Standard Type: National standards
Standard Status: Replaced
is_force_gb: no
CCS Name: Semi-metals and semiconductor materials
ICS Name: Semiconductor materials
Publish Date: 2011-01-10
Implement Date: 2011-10-01
Pages: 23 pages

Scope

1.1 This method is suitable for measuring the carrier recombination lifetime of uniformly doped, polished n-type or p-type silicon wafers. This method is non-destructive and contactless. Under the condition that the sensitivity of the conductivity detection system is sufficient, this method can also be applied to testing the carrier recombination lifetime of cut or polished, corroded silicon wafers.
1.2 The lower limit of the room-temperature resistivity of the tested silicon wafers is determined by the limit of the sensitivity of the detection system, usually between 0.05 Ω·cm and 1 Ω·cm.
Note: This detection method is suitable for measuring the carrier recombination lifetime in the range of 0.25 μs to >1 ms. The shortest measurable lifetime value depends on the shutdown characteristics of the light source and the sampling frequency of the attenuation signal detector, and the longest measurable value depends on the geometric conditions of the sample and the degree of passivation on the surface of the wafer. With appropriate passivation processes, such as thermal oxidation or immersion in appropriate solutions, the lifetime values up to tens of milliseconds can also be measured for polished wafers specified in GB/T 12964 "Polished Silicon Single Crystal Wafers".
1.3 The analysis of the process, the inspection of contamination sources, and the interpretation of measurement data to determine the formation mechanism and nature of impurity centers are not within the scope of this method. This method can only identify the process that introduces contamination under very limited conditions, such as by comparing the carrier recombination lifetime test values before and after a specific process, and identifying certain individual impurity types.

Development Information

Word Count: 43 Thousand words Pages: 23 pages

Superseded by the following standards

Referenced Standards

GB/T 1553-2009 Test methods for minority carrier lifetime in bulk germanium and silicon by measurement of photoconductivity decay YS/T 679-2008 Test methods for minority carrier diffusion length in extrinsic semiconductors by measurement of steady-state surface photovoltage SEMI MF978 SEMI MF1388 SEMI MF1530 GB/T 1550-1997 Standard methods for measuring conductivity type of extrinsic semiconducting materials GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials GB/T 1552-1995 Test method for measuring resistivity of monocrystal silicon and germanium with a collinear four-probe array GB/T 6616-1995 Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge GB/T 6616-2023 Test method for resistivity of semiconductor wafers and sheet resistance of semiconductor films—Noncontact eddy-current gauge GB/T 6618-1995 Test method for thickness and total thickness variation of silicon slices GB/T 6618-2009 Test method for thickness and total thickness variation of silicon slices GB/T 11446.1-1997 Electronic grade water GB/T 11446.1-2013 Electronic grade water GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon GB/T 13389-2014 Practice for conversion between resistivity and dopant density for boron-doped,phosphorus-doped,and arsenic-doped silicon GB/T 14264-1993 Semiconductor materials—Terms and definitions GB/T 14264-2009 Semiconductor materials—Terms and definitions GB/T 14264-2024 Terminology of semiconductor materials

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