GB/T 26068-2018 Active National standards

GB/T 26068-2018 Test method for carrier recombination lifetime in silicon wafers and silicon ingots—Non-contact measurement of photoconductivity decay by microwave reflectance method

GB/T 26068-2018 Test method for carrier recombination lifetime in silicon wafers and silicon ingots—Non-contact measurement of photoconductivity decay by microwave reflectance method

Publish Date: 2018-12-28 Implement Date: 2019-11-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 26068-2018
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: \nTest methods for the physical properties of metals
ICS Name: \nMetal material testing
Publish Date: 2018-12-28
Implement Date: 2019-11-01
Publisher: 国家市场监督管理总局、中国国家标准化管理委员会
Technical Committee: 全国半导体设备和材料标准化技术委员会(SAC/TC 203)、全国半导体设备和材料标准化技术委员会材料分会(SAC/TC 203/SC 2)
Pages: 29 pages

Scope

本标准规定了单晶和铸造多晶的硅片及硅锭的载流子复合寿命的非接触微波反射光电导衰减测试方法。本标准适用于硅锭和经过抛光处理的n型或p型硅片(当硅片厚度大于1 mm时,通常称为硅块)载流子复合寿命的测试。在电导率检测系统灵敏度足够的条件下,本标准也可用于测试切割或经过研磨、腐蚀的硅片的载流子复合寿命。通常,被测样品的室温电阻率下限在0.05 Ω·cm~10 Ω·cm之间,由检测系统灵敏度的极限确定。载流子复合寿命的测试范围为大于0.1 μs,可测的最短寿命值取决于光源的关断特性及衰减信号测定器的采样频率,最长可测值取决于样品的几何条件及其表面的钝化程度。

Development Information

Drafting Units:

有研半导体材料有限公司、瑟米莱伯贸易(上海)有限公司、中国计量科学研究院、浙江省硅材料质量检验中心、广州市昆德科技有限公司、江苏协鑫硅材料科技发展有限公司、天津市环欧半导体材料技术有限公司、北京合能阳光新能源技术有限公司

Drafting Persons:

曹孜、孙燕、黄黎、赵而敬、徐红骞、高英、石宇、楼春兰、王昕、张雪囡、林清香、刘卓、肖宗杰

Word Count: 56 Thousand words Pages: 29 pages

Replace the following standards

Referenced Standards

GB/T 11446.1-2013 Electronic grade water SEMI MF978 GB/T 1550-1997 Standard methods for measuring conductivity type of extrinsic semiconducting materials GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials GB/T 1551-1995 Test method for resistivity of silicon and germanium bars using a two-point probe GB/T 1551-2009 Test method for measuring resistivity of monocrystal silicon GB/T 1551-2021 Test method for measuring resistivity of monocrystal silicon—In-line four-point probe and direct current two-point probe method GB/T 1553-1997 Standard test methods for minority carrier lifetime in bulk germanium and silicon by measurement of photoconductivity decay GB/T 1553-2009 Test methods for minority carrier lifetime in bulk germanium and silicon by measurement of photoconductivity decay GB/T 1553-2023 Test methods for minority carrier lifetime in bulk silicon and germanium—Photoconductivity decay method GB/T 6616-1995 Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge GB/T 6616-2023 Test method for resistivity of semiconductor wafers and sheet resistance of semiconductor films—Noncontact eddy-current gauge GB/T 6618-1995 Test method for thickness and total thickness variation of silicon slices GB/T 6618-2009 Test method for thickness and total thickness variation of silicon slices GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon GB/T 13389-2014 Practice for conversion between resistivity and dopant density for boron-doped,phosphorus-doped,and arsenic-doped silicon GB/T 14264-1993 Semiconductor materials—Terms and definitions GB/T 14264-2009 Semiconductor materials—Terms and definitions GB/T 14264-2024 Terminology of semiconductor materials YS/T 679-2008 Test methods for minority carrier diffusion length in extrinsic semiconductors by measurement of steady-state surface photovoltage YS/T 679-2018 The test of minority carrier diffusion length in non-intrinsic semiconductor using surface photovoltage method

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