GB/T 7576-2026 Discrete semiconductor devices—Blank detail specification for high power bipolar transistors

GB/T 7576-1998 Semiconductor devices—Discrete devices Part 7:Bipolar transistors Section Four—Blank detail specification for case-rated bipolar transistors for high-frequency amplification GB/T 7577-1996 Blank detail specification for case-rated bipolar transistors for low-frequency amplification

GB/T 249-2017 The rule of type designation for discrete semiconductor devices GB/T 249-2026 Rule of type designation for discrete semiconductor devices GB/T 2423.2-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Tests B:Dry heat GB/T 2423.5-1995 Environmental testing for electric and electronic products—Part 2:Test methods—Test Ea and guidance:Shock GB/T 2423.5-2019 Environmental testing—Part 2:Test methods—Test Ea and guidance:Shock GB/T 2423.15-1995 Environmental testing for electric and electronic products—Part 2:Test methods—Test Ga and guidance:Acceleration, steady state GB/T 2423.15-2008 Environmental testing for electric and electronic products—Part 2:Tests methods—Test Ga and guidance: Acceleration,steady GB/T 2423.21-1991 Basic environmental testing procedures for electric and electronic products—Test M:Low air pressure GB/T 2423.21-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test M:Low air pressure GB/T 2423.21-2025 Environmental testing—Part 2:Test methods—Test M:Low air pressure GB/T 4587-2023 Semiconductor devices—Discrete devices—Part 7:Bipolar transistors GB/T 4589.1-2006 Semiconductor devices—Part 10:Generic specification for discrete devices and integrated circuits GB/T 4937.3-2012 Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination GB/T 4937.4-2012 Semiconductor devices—Mechanical and climatic test methods—Part 4:Damp heat,steady state,highly accelerated stress test(HAST) GB/T 4937.8-2025 Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing GB/T 4937.9-2026 Semiconductor devices—Mechanical and climatic test methods—Part 9:Permanence of marking GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12:Vibration,variable frequency GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity） GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life GB/T 4937.24-2025 Semiconductor devices—Mechanical and climatic test methods—Part 24:Accelerated moisture resistance—Unbiased HAST GB/T 4937.25-2025 Semiconductor devices—Mechanical and climatic test methods—Part 25:Temperature cycling GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices(internally induced) GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices(externally induced) GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34: Power cycling GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35:Acoustic microscopy for plastic encapsulated electronic components GB/T 7581-1987 Dimensions of outlines for semiconductor discrete devices IEC 60749-5 GB/T 4023.1-2026 Discrete semiconductor devices—Part 1:Sectional specification GB/T 7581-2026 Dimensions of outlines for discrete semiconductor devices