GB/T 30858-2014 Replaced National standards

GB/T 30858-2014 Polished mono-crystalline sapphire substrate product

GB/T 30858-2014 Polished mono-crystalline sapphire substrate product

Publish Date: 2014-07-24 Implement Date: 2015-04-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 30858-2014
Standard Type: National standards
Standard Status: Replaced
is_force_gb: no
CCS Name: Compound semiconductor materials
ICS Name: Semiconductor materials
Publish Date: 2014-07-24
Implement Date: 2015-04-01
Pages: 24 pages

Scope

This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation, storage, quality certificates, and order forms (or contracts) for polished sapphire single-crystal substrates.
This standard applies to single-sided polished sapphire substrates (hereinafter referred to as sapphire substrates).

Development Information

Word Count: 36 Thousand words Pages: 24 pages

Superseded by the following standards

Referenced Standards

GB/T 1031-1995 Surface roughness parameters and their values GB/T 1031-2009 Geometrical Product Specifications (GPS)—Surface texture:Profile method—Surface roughness parameters and their values GB/T 1555-1997 Test methods for determining the orientation of a semiconductor single crystal GB/T 1555-2009 Testing methods for determining the orientation of a semiconductor single crystal GB/T 1555-2023 Test methods for determining the orientation of a semiconductive single crystal GB/T 2828.1-2003 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 2828.1-2012 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 6619-1995 Test methods for bow of silicon slices GB/T 6619-2009 Test methods for bow of silicon wafers GB/T 6620-1995 Test method for measuring warp on silicon slices by noncontact scanning GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning GB/T 6624-1995 Standard method for measuring the surface quality of polished silicon slices by visual inspection GB/T 6624-2009 Standard method for measuring the surface quality of polished silicon slices by visual inspection GB/T 13387-1992 Test method for measuring flat length on slices of electronic materials GB/T 13387-2009 Test method for measuring flat length wafers of silicon and other electronic materials GB/T 14140-2009 Test method for measuring diameter of semiconductor wafer GB/T 14140.1-1993 Silicon slices and wafers—Measuring of diameter—Optical projecting method GB/T 14140.2-1993 Silicon slices and wafers—Measuring of diameter—Micrometer method GB/T 14264-1993 Semiconductor materials—Terms and definitions GB/T 14264-2009 Semiconductor materials—Terms and definitions GB/T 14264-2024 Terminology of semiconductor materials GB/T 19921-2005 Test method of particles on silicon wafer surfaces GB/T 19921-2018 Test method for particles on polished silicon wafer surfaces GB/T 30857-2014 Standard test method for thickness and thickness variation on sapphire substrates GB/T 14140-2025 Test method for measuring diameter of semiconductor wafer

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