GB/T 43885-2024 Active National standards

GB/T 43885-2024 Silicon carbide epitaxial wafers

GB/T 43885-2024 Silicon carbide epitaxial wafers

Publish Date: 2024-04-25 Implement Date: 2024-11-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: GB/T 43885-2024
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Compound semiconductor materials
ICS Name: Semiconductor materials
Publish Date: 2024-04-25
Implement Date: 2024-11-01
Pages: 11 pages

Scope

This document specifies the product classification, technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of silicon carbide epitaxial wafers. This document is applicable to epitaxial wafers grown on conductive silicon carbide substrates with homogeneous silicon carbide epitaxial layers, which are used to fabricate silicon carbide power electronic devices.

Development Information

Word Count: 21 Thousand words Pages: 11 pages

Referenced Standards

GB/T 2828.1-2012 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 6624-1995 Standard method for measuring the surface quality of polished silicon slices by visual inspection GB/T 6624-2009 Standard method for measuring the surface quality of polished silicon slices by visual inspection GB/T 14146-1993 Silicon epitaxial layers—Determination of carrier concentration—Mercury probe Valtage-capacitance method GB/T 14146-2009 Silicon epitaxial layers-determination of carrier concentration-mercury probe voltages-capacitance method GB/T 14146-2021 Test method for carrier concentration of silicon epitaxial layers—Capacitance-voltage method GB/T 14264-1993 Semiconductor materials—Terms and definitions GB/T 14264-2009 Semiconductor materials—Terms and definitions GB/T 14264-2024 Terminology of semiconductor materials GB/T 19921-2005 Test method of particles on silicon wafer surfaces GB/T 19921-2018 Test method for particles on polished silicon wafer surfaces GB/T 29505-2013 Test method for measuring surface roughness on planar surfaces of silicon wafer GB/T 30656-2014 Polished monocrystalline silicon carbide wafers GB/T 30656-2023 Polished monocrystalline silicon carbide wafers GB/T 32278-2015 Test method for flatness of monocrystalline silicon carbide wafers GB/T 39145-2020 Test method for the content of surface metal elements on silicon wafers—Inductively coupled plasma mass spectrometry GB/T 42902-2023 Test method for surface defects on silicon carbide epitaxial wafers—Laser scattering method GB/T 42905-2023 Test method for thickness of silicon carbide epitaxial layer—Infrared reflectance method YS/T 28-1992 Silicon wafer packaging YS/T 28-2015 Package of silicon wafers YS/T 28-2024 YS/T 28-2024 Silicon wafer packaging and labeling GB/T 32278-2025 Test method for thickness and fltaness of monocrystalline silicon carbide wafers

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