YS/T 1167-2016 Monocrystalline silicon etched wafers
YS/T 1167-2016 Monocrystalline silicon etched wafers
Basic Information
Scope
This standard specifies the grades and classification, requirements, test methods, inspection rules, and marking, packaging, transportation, storage, quality certificates, and order forms (or contracts) of silicon single-crystal corrosion slices.
This standard applies to acid corrosion slices and alkali corrosion slices (hereinafter referred to as corrosion slices) prepared by removing the surface damage layer with chemical corrosion solution from silicon single-crystal grinding slices prepared by the direct-pulling method and the floating zone melting method (including zone melting neutron transmutation and gas phase doping). The products are mainly used for making semiconductor components such as transistors, rectifiers, ultra-high power thyristors, and photoelectric devices, or for further processing into silicon polished slices.