GB/T 44334-2024 Active National standards

GB/T 44334-2024 Silicon epitaxial wafers with buried layers

GB/T 44334-2024 Silicon epitaxial wafers with buried layers

Publish Date: 2024-08-23 Implement Date: 2025-03-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 44334-2024
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Element semiconductor materials
ICS Name: Semiconductor materials
Publish Date: 2024-08-23
Implement Date: 2025-03-01
Pages: 16 pages

Scope

This document specifies the product classification, technical requirements, test methods, inspection rules, and marking, packaging, transportation, storage, accompanying documents, and order form content of buried-layer silicon epitaxial wafers.
This document is applicable to the production, testing, analysis, and quality evaluation of silicon epitaxial wafers with buried-layer structures. The products are mainly used for manufacturing integrated circuit chips and semiconductor discrete devices.

Development Information

Word Count: 21 Thousand words Pages: 16 pages

Referenced Standards

GB/T 2828.1-2012 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 1550-1997 Standard methods for measuring conductivity type of extrinsic semiconducting materials GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials GB/T 6617-1995 Test method for measuring resistivity of silicon wafers using spreading resistance probe GB/T 6617-2009 Test method for measuring resistivity of silicon wafer using spreading resistance probe GB/T 6624-1995 Standard method for measuring the surface quality of polished silicon slices by visual inspection GB/T 6624-2009 Standard method for measuring the surface quality of polished silicon slices by visual inspection GB/T 12964-2003 Monocrystalline silicon polished wafers GB/T 12964-2018 Monocrystalline silicon polished wafers GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon GB/T 13389-2014 Practice for conversion between resistivity and dopant density for boron-doped,phosphorus-doped,and arsenic-doped silicon GB/T 14139-1993 Silicon epitaxial wafers GB/T 14139-2009 Silicon epitaxial wafers GB/T 14139-2019 Silicon epitaxial wafers GB/T 14141-1993 Test method for sheet resistance of silicon epitaxial, diffused and ion-implanted layers using a collinear four-probe array GB/T 14141-2009 Test method for sheet resistance of silicon epitaxial,diffused and ion-implanted layers using a collinear four-probe array GB/T 14142-1993 Test method for crystallographic perfection of epitaxial layers in silicon by etching techniques GB/T 14142-2017 Test method for crystallographic perfection of epitaxial layers in silicon—Etching technique GB/T 14146-1993 Silicon epitaxial layers—Determination of carrier concentration—Mercury probe Valtage-capacitance method GB/T 14146-2009 Silicon epitaxial layers-determination of carrier concentration-mercury probe voltages-capacitance method GB/T 14146-2021 Test method for carrier concentration of silicon epitaxial layers—Capacitance-voltage method GB/T 14264-1993 Semiconductor materials—Terms and definitions GB/T 14264-2009 Semiconductor materials—Terms and definitions GB/T 14264-2024 Terminology of semiconductor materials GB/T 14847-1993 Test method for thickness of lightly doped silicon epitaxial layers on heavily doped silicon substrates by infrared reflectance GB/T 14847-2010 Test method for thickness of lightly doped silicon epitaxial layers on heavily doped silicon substrates by infrared reflectance GB/T 19921-2005 Test method of particles on silicon wafer surfaces GB/T 19921-2018 Test method for particles on polished silicon wafer surfaces GB/T 24578-2009 Test method for measuring surface metal contamination on silicon wafers by total reflection X-ray fluorescence spectroscopy GB/T 24578-2015 Test method for measuring surface metal contamination on silicon wafers by total reflection X-Ray fluorescence spectroscopy GB/T 24578-2024 Test method for measuring surface metal contamination on semiconductor wafers—Total reflection X-Ray fluorescence spectroscopy GB/T 29507-2013 Test method for measuring flatness,thickness and total thickness variation on silicon wafers—Automated non-contact scanning GB/T 32280-2015 Test method for warp of silicon wafers—Automated non-contact scanning method GB/T 32280-2022 Test method for warp and bow of silicon wafers—Automated non-contact scanning method GB/T 35310-2017 200 mm silicon epitaxial wafer GB/T 39145-2020 Test method for the content of surface metal elements on silicon wafers—Inductively coupled plasma mass spectrometry YS/T 28-1992 Silicon wafer packaging YS/T 28-2015 Package of silicon wafers YS/T 28-2024 YS/T 28-2024 Silicon wafer packaging and labeling GB/T 14847-2025 Test method for thickness of lightly doped silicon epitaxial layers on heavily doped silicon substrates—Infrared reflectance method

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