SJ/T 11086-1996 Specification of gap sparker for type FD08, FD12 and FD15

GB/T 2423.55-2023 Environmental testing—Part 2:Test methods—Test Eh:Hammer tests GB/T 2423.56-2006 Environmental testing for electric and electronic products—Part 2:Test methods—Test Fh:Vibration, broad-band random(digital control)and guidance GB/T 2423.56-2018 Environmental testing—Part 2:Test methods—Test Fh:Vibration, broadband random and guidance GB/T 2423.56-2023 Environmental testing—Part 2:Test methods—Test Fh:Vibration,broadband random and guidance GB/T 2423.57-2008 Environmental testing for electric and electronic products—Part 2:Tests—Test Ei:Shock—Shock response spectrum synthesis GB/T 2423.58-2008 Environmental testing for electric and electronic products—Part 2:Tests methods—Test Fi:Vibration—Mixed Mode GB/T 2423.59-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test Z/ABMFh:Combined temperature(cold and heat)/low air pressure/vibration(random) GB/T 2423.60-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test U:Robustness of terminations and integral mounting devices GB/T 2423.61-2018 Environmental testing—Part 2:Test methods—Test and guidance:Dust and sand test for large specimen GB/T 2423.62-2018 Environmental testing—Part 2:Test motheds—Test Fx and guidance:Mulit input mulit output vibration test GB/T 2423.63-2019 Environmental testing—Part 2:Test methods—Test:combined temperature(cold and heat)/low air pressure/vibration(mixed mode) GB/T 2423.64-2023 Environmental testing—Part 2:Test methods—Test Fj:Vibration—Long time history replication GB/T 2423.65-2024 Environmental testing—Part 2:Test methods—Test:Combined salt mist/temperature/humidity/solar radiation GB/T 2423.66-2025 Environmental testing—Part 2:Test methods—Test:Combined temperature/humidity/static load GB/T 2423.101-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test:Inclinations and swings GB/T 2423.101-2025 Environmental testing—Part 2:Test methods—Test:Inclinations and swings GB/T 2423.102-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test: combined temperature(cold and heat)/low air pressure/vibration(sinusoidal) GB/T 2828.1-2003 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 2828.1-2012 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 2828.2-2008 Sampling procedures for inspection by attributes—Part 2:Sampling plans indexed by limiting quality(LQ)for isolated lot inspection GB/T 2828.3-2008 Sampling procedures for inspection by attributes—Part 3:Skip-lot sampling procedures GB/T 2828.4-2008 Sampling procedures for inspection by attributes—Part 4:Procedures for assessment of declared quality levels GB/T 2828.5-2011 Sampling procedures for inspection by attributes—Part 5:System of sequential sampling plans indexed by acceptance quality limit(AQL)for lot-by-lot inspection GB/T 2828.10-2010 Sampling procedures for inspection by attributes—Part 10:Introduction to the GB/T 2828 series of standards for sampling for inspection by attributes GB/T 2828.11-2008 Sampling procedures for inspection by attributes—Part 11:Procedures for assessment of declared quality levels for small population GB 4936.1 GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices GB/T 4937.1-2006 Semiconductor devices—Mechanical and climatic test methods—Part 1:General GB/T 4937.2-2006 Semiconductor devices—Mechanical and climatic test methods—Part 2:Low air pressure GB/T 4937.3-2012 Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination GB/T 4937.4-2012 Semiconductor devices—Mechanical and climatic test methods—Part 4:Damp heat,steady state,highly accelerated stress test(HAST) GB/T 4937.8-2025 Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing GB/T 4937.9-2026 Semiconductor devices—Mechanical and climatic test methods—Part 9:Permanence of marking GB/T 4937.10-2025 Semiconductor devices—Mechanical and climatic tests methods—Part 10:Mechanical Shock—Device and subassembly GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12:Vibration,variable frequency GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity） GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices GB/T 4937.16-2025 Semiconductor devices—Mechanical and climatic test methods—Part 16:Particle impact noise detection(PIND) GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose) GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20:Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life GB/T 4937.24-2025 Semiconductor devices—Mechanical and climatic test methods—Part 24:Accelerated moisture resistance—Unbiased HAST GB/T 4937.25-2025 Semiconductor devices—Mechanical and climatic test methods—Part 25:Temperature cycling GB/T 4937.26-2023 Semiconductor devices—Mechanical and climate test methods—Part 26:Electrostatic discharge(ESD)sensitivity testing—Human body model(HBM) GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27:Electrostatic discharge (ESD) sensitivity testing—Machine model (MM) GB/T 4937.28-2026 Semiconductor devices—Mechanical and climate test methods—Part 28:Electrostatic discharge(ESD)sensitivity testing—Charged device model(CDM)—device level GB/T 4937.29-2025 Semiconductor devices—Mechanical and climatic test methods—Part 29:Latch-up test GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices(internally induced) GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices(externally induced) GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33:Accelerated moisture resistance—Unbiased autoclave GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34: Power cycling GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35:Acoustic microscopy for plastic encapsulated electronic components GB/T 4937.36-2025 Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration,steady state GB/T 4937.37-2025 Semiconductor devices—Mechanical and climatic test methods—Part 37:Board level drop test method using an accelerometer GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38:Soft error test method for semiconductor devices with memory GB/T 4937.39-2025 Semiconductor devices—Mechanical and climatic test methods—Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components GB/T 4937.40-2025 Semiconductor devices—Mechanical and climatic test methods—Part 40:Board level drop test method using a strain gauge GB/T 4937.41-2026 Semiconductor devices—Mechanical and climatic test methods—Part 41:Test method for reliability of non-volatile memory devices GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage GB/T 4937.44-2025 Semiconductor devices—Mechanical and climatic test methods—Part 44:Neutron beam irradiated single event effect(SEE) test method for semiconductor devices GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling,packing,labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat